The thickness of the gold plating on a PCB is a critical parameter that directly influences its performance. Gold thickness is measured in microinches (µin) or micrometers (µm). While a thin layer of gold is sufficient to provide the desired benefits, a thicker layer may be required for specific applications, such as environments with high humidity or corrosive elements. The industry standard for gold plating on PCBs ranges from 1 to 3 µin.